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Leading supplier of Ceramic Metallization Solutions for DBC and DPC

Metalized ceramic substrates combine the benefits of ceramic and metal materials, making them essential in the semiconductor industry. They primarily serve to provide reliable electrical and thermal connections between electronic components and printed circuit boards. Common ceramic materials used include Aluminum Oxide (Al2O3) and Aluminum Nitride (AlN). The metallization is typically carried out through Direct Bonded Copper (DBC) or Direct Plated Copper (DPC) processes.

Direct Plated Copper (DPC)

Direct Bonded Copper (DBC)

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